M
MEFRON
IoT

IoT Gateway Device

Complete box-build assembly for a smart IoT gateway — multi-layer PCB, custom enclosure moulding, firmware programming, and global certification.

Box Build IoT RF Assembly CE/FCC Firmware Programming
40%
Time-to-Market Reduction
1st Pass
Certification Submissions
10K+ units
Production Capacity
Turnkey
Assembly Type
IoT Gateway Device

About the Project

A technology startup engaged Mefron for end-to-end manufacturing of their IoT gateway device — from PCB assembly to final box build. The device features multi-layer PCBs with RF/Wi-Fi modules, a custom injection-moulded enclosure, and onboard firmware. Mefron handled the complete supply chain including component sourcing, PCBA, enclosure production, programming, testing, and packaging — all under one roof.

Project Highlights

Multi-layer PCB assembly with RF modules, BLE, and Wi-Fi chipsets
Custom plastic injection-moulded enclosure designed and tooled in-house
Firmware programming, boot testing, and calibration on automated test jigs
Environmental stress screening (ESS) — thermal cycling and vibration
CE and FCC pre-compliance testing support
Scalable from 500-unit pilot run to 10,000-unit mass production

Project Outcome

Reduced the client's time-to-market by 40% compared to distributed manufacturing. Achieved CE and FCC certification on the first submission cycle.

Services Used

  • PCB Assembly
  • Box Build Assembly
  • Plastic Injection Molding
  • Circuit Design & Development

Industry

IoT

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